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Product Details:
Payment & Shipping Terms:
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| Purity: | Ta 99.95%(3N5) | Size: | φ76.2*3mm |
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| Surface Finish: | 16 Rms Max, Or Ra 0.4(RMS64 Or Better) | Flatness: | 0.1mm Or 0.15% Max |
| Material: | Tantalum | Appearance: | Silvery Sold, Bright And Clean |
| Surface: | Polished | Application: | Semiconductor |
| Packaging: | Exporting Fiberboard Box Or Upon Customers’ Requirements | Delivery Time: | 2-3weeks |
| High Light: | ta targets,tantalum disc |
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High Purity Tantalum Sputtering Targets Disc Targets 76.2*3mm Grain Size Below 100μm
Commodity: Tantalum Targets
Application: Coating materials for semiconductors, AF, AG film coating
Chemical Compositions:
Typical Analysis: 99.95%(3N5)
Metallic impurities, ppm max by weight
| Element | Al | Ag | Au | B | Bi | Ca | Cd | Cl | Co | Cr | Cu | Fe |
| Content | 0.2 | 1.0 | 1.0 | 0.1 | 1.0 | 0.1 | 1.0 | 1.0 | 0.05 | 0.25 | 0.75 | 0.4 |
| Element | Ga | Ge | Hf | K | Li | Mg | Mn | Mo | Na | Nb | Ni | P |
| Content | 1.0 | 1.0 | 1.0 | 0.05 | 0.1 | 0.1 | 0.1 | 5.0 | 0.1 | 75 | 0.25 | 1.0 |
| Element | Pb | S | Si | Sn | Th | Ti | V | W | Zn | Zr | Y | U |
| Content | 1.0 | 0.2 | 0.2 | 0.1 | 0.0 | 1.0 | 0.2 | 70.0 | 1.0 | 0.2 | 1.0 | 0.005 |
Non-Metallic impurities, ppm max by weight
| Element | C | H | O | N |
| Content | 100 | 15 | 150 | 100 |
Balance: Tantalum
Grain Size: Typical size<100μm Grain Size
Other grain size available upon request
Flatness: ≤0.2mm
Surface Roughness:Ra < 1.6μm
Size:φ76.2*3mm
Description:
Tantalum is featured the third highest melting point 2996℃ and high boiling point 5425℃. It has the characteristics of high temperature resistance, high corrosion resistance, cold machining and good welding performance. Therefore, tantalum is widely used in electronics, semiconductor, chemical, engineering, aviation, aerospace, medical, military industry etc. The application of tantalum will be more and more widely used in more industry with the technology progress and innovation.
Tantalum target is mainly applied in semiconductor industry and optical coating industry. We manufacture various specifications of tantalum sputtering targets upon the request of customers. The raw material tantalum ingots are smelted through vacuum EB furnace. By wary of unique rolling process, through complicated treatment and accurate annealing temperature and time, we produce different dimensions of the tantalum sputtering targets such as disc targets, rectangular targets and rotary targets. Moreover, we guarantee the tantalum purity is between 99.95% to 99.99% ; the grain size is below 100um, flatness is below 0.2mm and the Surface Roughness is below Ra.1.6μm. The size can be tailored by the customers’ requirements or customized as per drawings. We control our products quality through the raw material source till the whole production line and finally deliver to our customers in order to make sure you purchase our products with stable and same quality each lot.
Furthermore, we are glad to provide you the trade in service. We can recover your used sputtering targets to help you with supplying a same new one with lowest price. You are warmly welcome to tell your ideas or requirements to us in a win-win prospect. For more inquiry and information, please don’t hesitate to contact us at any time. We also expect your visit to our factory to witness our whole infrastructure, technology, products and our team.
Our Strength
Stable raw material supply from Chinese biggest tantalum/niobium hydrometallurgy smelter
Advanced technology and modern management
Quality control from the source
OEM services
Guarantee higher quality with lower price
Advanced equipment
Passed ISO 9001 (2015)
Contact Person: sales
